2 pad and 3 pad ceramic package, 3.1 mm x 3.7 mm ZTACV and zttcv series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 06/25/12_b specifications subject to change without notic e page 1 3 0.9 3.7 4.1 1.4 2 1 0.7 3.7 1.2 zttcv ZTACV zttcv - mx ZTACV - mx dimension units: mm 1.2 2 1 2 1 3 1 2 1 3 2 1.4 0.9 0.7 3.1 3.7 connection diagrams product features: applications: low cost storage media compatible with leadfree processing home appliance microprocessors office automation the terminations of the ZTACV and zttcv series ceramic resonator are pb free. pb may be contained in the ceramic resonator ele ment of this device and is exempted via item 7 of the rohs annex. this ceramic resonator series is considered rohs compliant. frequency 7 mhz to 50 mhz esr (equivalent series resistance) see table below frequency tolerance @ 25 ? c ? 0.5% frequency stability over temperature ? 0.3% aging ? 0.3% max. for 10 years temperature operating -40 ? c to +85 ? c storage -40 ? c to +85 ? c standard part frequency esr c1 c2 (mhz) ( ? max.) (pf) (pf) zttcv-mx 13 to 19.9 40 30 30 zttcv-mx 20 to 25.9 40 15 15 zttcv-mx 26 to 50 40 5 5 ZTACV-mx 7 to 12.9 60 30* 30* ZTACV-mx 13 to 19.9 40 30* 30* ZTACV-mx 20 to 25.9 40 15* 15* ZTACV-mx 26 to 50 40 5* 5* * recommended external capacitance, not internal to the device. part number guide sample part number: zttcv - mx - 20.000 part series package code frequency zttcv - (internal capacitors) ZTACV - (must supply external capacitance for proper circuit operation) mx - 20.000 mhz
2 pad and 3 pad ceramic package, 3.1 mm x 3.7 mm ZTACV and zttcv series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 06/25/12_b specifications subject to change without notic e page 2 pb free solder reflow profile: typical circuit: *units are backward compatible with 240c reflow processes package information: msl = 1 termination = e1 (sn / cu / ag). tape and reel information: environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: frequency quantity per reel 1000 a 12 +/-.3 b 8 +/-.2 c 5.5 +/-.2 d 13 +/-1 or 12 +/-3 e 60 / 80 f 180 / 250
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